Electronics and Semiconductors

Electronics and Semiconductors

Sputtering target was first used in semiconductors and electronics for front end and back end packaging, diffusion barriers, compounds, phase change memory, IC interconnects, micro contacts, sensors,and LED.

Sputtering targets and evaporation materials including copper and copper alloys( copper-nickel, copper-chromium)are manufactured for packaging and other applications, as well as nickel and many other nickel alloys( nickel-aluminum, nickel-vanadium, nickel-platinum, nickel-copper and nickel-chromium). Aluminum is available in its elemental form and alloyed with copper and silicon as aluminum-copper, aluminum-silicon and aluminum-copper-silicon(AlCu,AlSi,AlCuSi).Our titanium is available up to 99.999% purity and alloyed in titanium-tungsten(TiW).The conductive and solder wetting properties of gold make it an important deposition material, including gold alloys such as gold-tin, gold-antimony, gold-silicon, gold-copper, and gold-germanium. Recent materials include germanium-antimony alloyed with tellurium, silver, indium and platinum and light emitting diodes (LED) and transparent conductive oxides (TCO) for light emitting applications such as sensors. These include indium-tin oxide (ITO) and zinc oxide(ZnO) doped with aluminum and other elements (ZnO). Able Target Ltd also produces ultra high purity sputtering targets and other evaporation materials for electronic applications including hafnium(Hf), molybdenum(Mo), silver(Ag), iridium(In), rhodium(Rh) and ruthenium(Ru)

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