SPUTTERING DEPOSITION

SPUTTERING DEPOSITION

Sputtering deposition uses a plasma, which is usually formed from a non-reactive gas, to bombard the target material for the thin film and knock the atoms of the target material out of its bulk.

The ejected atoms then land on the substrate and form a thin film.  Since the target does not need to be heated, the technique is very flexible for a wide range of applications.  The targets can even be made of compounds or mixtures, not just pure elements.

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